Development of a low-cost Packaging for MEMS Pressure Sensors

被引：0

作者：

Ayala Penalver, Diego Conte ^{[1
]}

Furlan, Humber ^{[2
]}

Fraga, Mariana Amorim ^{[3
]}

机构：

[1] Ctr Paula Souza CEETEPS, Gestao & Tecnol Sistemas Prod, Sao Paulo, SP, Brazil

[2] Fac Tecnol Sao Paulo FATEC SP, Coordenadoria Mecan Precisao, Sao Paulo, SP, Brazil

[3] Fac Tecnol Sao Paulo FATEC SP, Dept Ensino Geral, Sao Paulo, SP, Brazil

来源：

2014 IEEE 9TH IBERO-AMERICAN CONGRESS ON SENSORS (IBERSENSOR) | 2014年

关键词：

packaging; MEMS; pressure sensors; low-cost;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Considerable research efforts have been devoted to the development of MEMS sensor packaging based on different material types (ceramic, plastic and metal). In this work, we describe the design, fabrication and test of a metal packaging with high reliability and low cost. The novelty of our research is on the packaging assembly by mechanical interference replacing the expensive plasma welding process that is used commonly in the development of traditional metal packaging.

引用

页数：3

共 5 条

[1]

Agostinho O. L., 2007, TOLERANCIAS AJUSTES

[2]

Brown SB, 1997, TRANSDUCERS 97 - 1997 INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS AND ACTUATORS, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, P591, DOI 10.1109/SENSOR.1997.613720

[3]

Bulba E. A., 2009, TOLERANCIAS MEDICOES

[4] MEMS sensor packaging using LTCC substrate technology [J].

Kopola, H ;

Lenkkeri, J ;

Kautio, K ;

Torkkeli, A ;

Rusanen, O ;

Jaakola, T .

DEVICE AND PROCESS TECHNOLOGIES FOR MEMS AND MICROELECTRONICS II, 2001, 4592 :148-158

[5] MEMS post-packaging by localized heating and bonding [J].

Lin, LW .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (04) :608-616

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