Optimum Design of Transformer-Type Marchand Balun Using Scalable Integrated Passive Device Technology

被引:22
作者
Huang, Chien-Hsiang [1 ]
Horng, Tzyy-Sheng [1 ]
Wang, Chen-Chao [2 ]
Chiu, Chi-Tsung [2 ]
Hung, Chih-Pin [2 ]
机构
[1] Natl Sun Yat Sen Univ, Dept Elect Engn, Kaohsiung 804, Taiwan
[2] Adv Semicond Engn Inc, Div Res & Dev, Kaohsiung 811, Taiwan
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2012年 / 2卷 / 08期
关键词
Integrated passive device; Marchand balun; planar transformer; scalable model; RF;
D O I
10.1109/TCPMT.2011.2171514
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A simple and effective technique for designing transformer-type Marchand baluns is presented in this paper. The coupled-line sections required in a Marchand balun design are realized using planar transformers with a scalable model. The proposed design technique enables the prediction and optimization of Marchand balun performance over a wide range of layout and process parameters. To demonstrate the optimization process, Marchand baluns are designed for implementation using silicon and glass integrated passive device (IPD) technologies. Finally, experimental verification shows very good agreement between the modeled and measured results, thereby validating the IPD design optimization.
引用
收藏
页码:1370 / 1377
页数:8
相关论文
共 28 条
[1]   Analysis and design of impedance-transforming planar Marchand baluns [J].
Ang, KS ;
Robertson, ID .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2001, 49 (02) :402-406
[2]  
[Anonymous], 1962, INDUCTANCE CALCULATI
[3]   Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits [J].
Carchon, G ;
Vaesen, K ;
Brebels, S ;
De Raedt, W ;
Beyne, E ;
Nauwelaers, B .
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (03) :510-519
[4]   BROAD-BAND MONOLITHIC PASSIVE BALUNS AND MONOLITHIC DOUBLE-BALANCED MIXER [J].
CHEN, TH ;
CHANG, KW ;
BUI, SB ;
WANG, H ;
DOW, GS ;
LIU, LCT ;
LIN, TS ;
TITUS, WS .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1991, 39 (12) :1980-1986
[5]   Wafer-level chip scale packaging: Benefits for integrated passive devices [J].
Clearfield, HM ;
Young, JL ;
Wijeyesekera, SD ;
Logan, EA .
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02) :247-251
[6]  
Eisenstadt W.R., 2006, ARTECH MICR, V3rd
[7]   S-PARAMETER-BASED IC INTERCONNECT TRANSMISSION-LINE CHARACTERIZATION [J].
EISENSTADT, WR ;
EO, YS .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (04) :483-490
[8]   THE CURRENT DISTRIBUTION AND AC RESISTANCE OF A MICROSTRIP STRUCTURE [J].
FARAJIDANA, R ;
CHOW, YL .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1990, 38 (09) :1268-1277
[9]   DESIGN OF PLANAR RECTANGULAR MICROELECTRONIC INDUCTORS [J].
GREENHOUSE, HM .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1974, PH10 (02) :101-109
[10]   Uniplanar broad-band push-pull FET amplifiers [J].
Hsu, PC ;
Nguyen, C ;
Kintis, M .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1997, 45 (12) :2150-2152