Wetting and spreading kinetics of liquid Sn on Ag and Ag3Sn substrates

被引：18

作者：

Liashenko, O. Y. ^{[1
,2
,3
]}

Hodaj, F. ^{[1
,2
]}

机构：

[1] Univ Grenoble Alpes, SIMAP, F-38000 Grenoble, France

[2] CNRS, SIMAP, Grenoble INP, F-38000 Grenoble, France

[3] Cherkasy Natl Univ, Cherkassy, Ukraine

来源：

SCRIPTA MATERIALIA | 2017年 / 127卷

关键词：

Wetting; Kinetics; Interfaces; Soldering; Ag3Sn; CU;

D O I：

10.1016/j.scriptamat.2016.08.035

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The isothermal wetting and spreading of liquid Sn on Ag and Ag3Sn substrates are studied for the first time using the dispensed drop technique under high vacuum at 300 degrees and 400 degrees C. The Sn/Ag3Sn interaction involves only dissolution of Ag3Sn in the molten phase while the Sn/Ag interaction involves both dissolution of Ag and Ag3Sn formation at the interface. Only one spreading regime is observed in Sn/Ag3Sn system and two spreading regimes in Sn/Ag system. The contact angles of liquid Sn on Ag and Ag3Sn substrates are evaluated and a mechanism of reactive spreading in the liquid Sn/Ag system is proposed. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：24 / 28

页数：5

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