Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface

被引：1

作者：

Hsieh, Yen-Hui ^{[1
]}

Huang, Yen-Jun ^{[2
]}

Shih, Jian-Yu ^{[2
]}

Leu, Jihperng ^{[3
]}

Chen, Kuan-Neng ^{[2
]}

机构：

[1] Natl Chiao Tung Univ, Dept Electrophys, Hsinchu 300, Taiwan

[2] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 300, Taiwan

[3] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 300, Taiwan

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2018年 / 8卷 / 02期

关键词：

Adhesion; heterogeneous integration; metal; polymer;

D O I：

10.1109/TCPMT.2017.2786031

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A method is built for describing the relationship between adhesion strength and chemical states of Co/polymer and Cr/polymer interfaces. Based on the chemical bonding model, the adhesion strength is confirmed to be dominated by the metal organic complex at the interfaces. For Cr/polymers interfaces, the formation of metal-organic complex is restricted by the oxidation of metal atoms during deposition, which leads to almost no variation in adhesion from low [benzocyclobutene(BCB)] to high (AZ 4620) oxygenated polymers. On the other hand, a strong adhesion is observed at the Co/BCB interface that arises from the metal-organic bonds associated with hydroxyl groups in the polymer. The method is expected to provide clear analysis to other metal-polymer interfaces for seeking proper combination in heterogeneous integration.

引用

页码：195 / 201

页数：7

共 26 条

[1] ADHESION OF POLYETHYLENE TO METALS [J].

BRIGHT, K ;

MALPASS, BW ;

PACKHAM, DE .

NATURE, 1969, 223 (5213) :1360-&

[2]

Cauwe M., 2014, P IMOLA WORKSH SMART, P1

[3]

Dietzel A., 2011, ULTRATHIN CHIP TECHN

[4] Integrating MEMS and ICs [J].

Fischer, Andreas C. ;

Forsberg, Fredrik ;

Lapisa, Martin ;

Bleiker, Simon J. ;

Stemme, Goran ;

Roxhed, Niclas ;

Niklaus, Frank .

MICROSYSTEMS & NANOENGINEERING, 2015, 1

[5] AN OVERVIEW OF THE BASIC ASPECTS OF POLYMER ADHESION .1. FUNDAMENTALS [J].

FOURCHE, G .

POLYMER ENGINEERING AND SCIENCE, 1995, 35 (12) :957-967

[6] GaN-based micro-LED arrays on flexible substrates for optical cochlear implants [J].

Gossler, Christian ;

Bierbrauer, Colin ;

Moser, Ruediger ;

Kunzer, Michael ;

Holc, Katarzyna ;

Pletschen, Wilfried ;

Koehler, Klaus ;

Wagner, Joachim ;

Schwaerzle, Michael ;

Ruther, Patrick ;

Paul, Oliver ;

Neef, Jakob ;

Keppeler, Daniel ;

Hoch, Gerhard ;

Moser, Tobias ;

Schwarz, Ulrich T. .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2014, 47 (20)

[7]

Greig W. J., 2007, INTEGRATED CIRCUIT P, P193

[8]

Huang L. L., 2013, FUNDAMENTALS ADHESIO, P50

[9] Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric [J].

Huang, Yen-Jun ;

Hsieh, Yen-Hui ;

Shih, Jian-Yu ;

Chen, Han-Chun ;

Leu, Jihperng ;

Chen, Kuan-Neng .

JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2016, 16 (07) :7546-7550

[10] Four-point bend adhesion measurements of copper and permalloy systems [J].

Hughey, MP ;

Morris, DJ ;

Cook, RF ;

Bozeman, SP ;

Kelly, BL ;

Chakravarty, SLN ;

Harkens, DP ;

Stearns, LC .

ENGINEERING FRACTURE MECHANICS, 2004, 71 (02) :245-261

← 1 2 3 →