In-Depth Study on the Effect of Active-Area Scale-Down of Solution-Processed TiOx

被引:4
作者
Jung, Seungjae [1 ]
Kong, Jaemin [1 ]
Kim, Tae-Wook [1 ]
Song, Sunghoon [1 ]
Lee, Kwanghee [1 ,2 ,3 ]
Lee, Takhee [1 ,3 ]
Hwang, Hyunsang [1 ,3 ]
Jeon, Sanghun [4 ]
机构
[1] Gwangju Inst Sci & Technol, Sch Mat Sci & Engn, Kwangju 500712, South Korea
[2] Gwangju Inst Sci & Technol, Heeger Ctr Adv Mat, Kwangju 500712, South Korea
[3] Gwangju Inst Sci & Technol, Dept Nanobio Mat & Elect, Kwangju 500712, South Korea
[4] Samsung Adv Inst Technol, Semicond Devices Lab, Yongin 446712, South Korea
基金
新加坡国家研究基金会;
关键词
Defect; joule heating; scale-down; solution-processing; titanium oxide; via-hole; SWITCHING CHARACTERISTICS; NANOFILAMENTS;
D O I
10.1109/LED.2012.2190376
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effect of active-area scale-down and improved memory performance of solution-processed TiOx were investigated using devices with active areas ranging from 50 x 50 mu m(2) to 200 x 200 nm(2). As the active area decreases, higher operation voltages were required owing to the reduction of unintended extrinsic defects resulting from solution processing. Moreover, faster switching speeds were observed with decreasing active area, which is induced by incremental Joule heating. These scale-down effects provided enhanced reliability characteristics such as highly uniform operation voltages and resistance states and improved pulse endurance by minimizing extrinsic defect-related nonuniformity and introducing additional heating-assisted filamentary switching.
引用
收藏
页码:869 / 871
页数:3
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