On Asymmetric Diffusional Solidification During Transient Liquid Phase Bonding

被引：8
作者：
Bigvand, A. Ghobadi [1 ]
Ojo, Olanrewaju A. [1 ]
机构：
[1] Univ Manitoba, Dept Mech & Mfg Engn, Winnipeg, MB R3T 5V6, Canada
来源：
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 2014年 / 45A卷 / 04期
基金：
加拿大自然科学与工程研究理事会;
关键词：
TEMPERATURE-GRADIENT; SYSTEM; ALLOY;
D O I：
10.1007/s11661-014-2208-2
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The underlying cause of asymmetric diffusion solidification which alters microstructure during transient liquid phase bonding under low temperature gradient was studied. A new solute-conserving asymmetric numerical model coupled with experimental verification showed that a transition from bi-directional to unidirectional solidification, under a constant temperature gradient, is controlled by competition between liquid and solid-state diffusion at one of the two liquid-solid interfaces. This mechanistic understanding would aid a more effective use of the process.
引用
收藏
页码：1670 / 1674
页数：5
相关论文
共 13 条
  • [1] On the Extension of Processing Time with Increase in Temperature during Transient-Liquid Phase Bonding
    Abdelfatah, M. M.
    Ojo, O. A.
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2009, 40A (02): : 377 - 385
  • [2] Transient liquid phase diffusion bonding under a temperature gradient: Modelling of the interface morphology
    Assadi, H
    Shirzadi, AA
    Wallach, ER
    [J]. ACTA MATERIALIA, 2001, 49 (01) : 31 - 39
  • [3] Bigvand A. Ghobadi, 2013, THESIS U MANITOBA
  • [4] Critical interlayer thickness for transient liquid phase bonding in the Cu-Sn system
    Bosco, NS
    Zok, FW
    [J]. ACTA MATERIALIA, 2004, 52 (10) : 2965 - 2972
  • [5] A diffusional model for transient liquid phase bonding
    Cain, SR
    Wilcox, JR
    Venkatraman, R
    [J]. ACTA MATERIALIA, 1997, 45 (02) : 701 - 707
  • [6] Transient liquid-phase bonding in the Ni-Al-B system
    Campbell, CE
    Boettinger, WJ
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2000, 31 (11): : 2835 - 2847
  • [7] Asymmetric Diffusional Solidification during Transient Liquid Phase Bonding of Dissimilar Materials
    Ghoneim, A.
    Ojo, O. A.
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2012, 43A (03): : 900 - 911
  • [8] Numerical solutions of diffusion-controlled moving boundary problems which conserve solute
    Illingworth, TC
    Golosnoy, IO
    [J]. JOURNAL OF COMPUTATIONAL PHYSICS, 2005, 209 (01) : 207 - 225
  • [9] Study of Ni-Cr-Co-W-Mo-B interlayer alloy and its bonding behaviour for a Ni-base single crystal superalloy
    Li, W
    Jin, T
    Sun, XF
    Guo, Y
    Guan, HR
    Hu, ZQ
    [J]. SCRIPTA MATERIALIA, 2003, 48 (09) : 1283 - 1288
  • [10] Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions
    Park, M. S.
    Gibbons, S. L.
    Arroyave, R.
    [J]. ACTA MATERIALIA, 2012, 60 (18) : 6278 - 6287
12