Microstructure, mechanical properties, and electrical conductivity of the solid-state recycled pure copper machining chips

被引:7
作者
Behnagh, Reza Abdi [1 ]
Abdollahi, Hadi [1 ]
Pour, Mohsen Agha Mohammad [1 ]
Shahbazi, Bahman [2 ]
机构
[1] Urmia Univ Technol, Fac Mech Engn, 2nd Kilometer Band Rd, Orumiyeh 5716693187, Iran
[2] Iran Univ Sci & Technol, Sch Mech Engn, Tehran, Iran
关键词
Friction stir consolidation; copper; recycling; microstructure; hardness; electrical conductivity;
D O I
10.1177/1464420720957366
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The demand for new methods to reduce CO(2)emission by reusing metal scrap has increased recently. This study deals with a new recycling technique utilizing a friction stir consolidation process. In this work, copper was directly recycled from machining chips in the solid-state form without any remelting to reduce environmental pollution and to increase the economic value of the waste material. During the process, copper chips were loaded into the chamber; then, a rotating tool was plunged into the chips at a specified rotational speed and feed rate. Due to the huge amount of heat generated, the softened material was compressed and synthesized to form a consolidated part. Microstructure, mechanical properties, and electrical conductivity of the finished samples were evaluated and compared with as-received material. Also, a numerical model was implemented to predict the evolution of the main field variables, including temperature, density, and strain.
引用
收藏
页码:195 / 201
页数:7
相关论文
共 17 条
  • [11] Shear compaction processing of SiC nanoparticles reinforced magnesium composites directly from magnesium chips
    Narvan, Morteza
    Behnagh, Reza Abdi
    Shen, Ninggang
    Givi, Mohammad Kazem Besharati
    Ding, Hongtao
    [J]. JOURNAL OF MANUFACTURING PROCESSES, 2016, 22 : 39 - 48
  • [12] Electrical properties of copper films produced by MOCVD
    Riedel, S
    Rober, J
    Gessner, T
    [J]. MICROELECTRONIC ENGINEERING, 1997, 33 (1-4) : 165 - 172
  • [13] PLASTICITY THEORY FOR POROUS METALS
    SHIMA, S
    OYANE, M
    [J]. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 1976, 18 (06) : 285 - 291
  • [14] Ultrafine grained copper alloy sheets having both high strength and high electric conductivity
    Takata, Naoki
    Lee, Seong-Hee
    Tsuji, Nobuhiro
    [J]. MATERIALS LETTERS, 2009, 63 (21) : 1757 - 1760
  • [15] Friction Consolidation Processing of n-Type Bismuth-Telluride Thermoelectric Material
    Whalen, Scott
    Jana, Saumyadeep
    Catalini, David
    Overman, Nicole
    Sharp, Jeffrey
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2016, 45 (07) : 3390 - 3399
  • [16] Wright S., 2002, P GREEN PROC 2002 IN, P335
  • [17] Ying T, 2010, T NONFERR METAL SOC, P20