Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 °C

被引：29
作者：
Feller, L. [1 ]
Hartmann, S. [1 ]
Schneider, D. [1 ]
机构：
[1] ABB Switzerland Ltd, Semicond, CH-5600 Lenzburg, Switzerland
来源：
MICROELECTRONICS RELIABILITY | 2008年 / 48卷 / 8-9期
关键词：
Junction temperature;
D O I：
10.1016/j.microrel.2008.07.019
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The increased demand for higher operating junction temperatures in IGBT modules is a main challenge for future packaging technologies. Two critical design features regarding this aspect include the terminal solder joints and the large area solder joints. The main focus of this investigation is on the consequences of raising the maximum operating temperature of IGBT modules and the required design modifications of solder materials at a microstructure level for tackling the drawbacks of state-of-the-art technologies. (c) 2008 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1161 / 1166
页数：6
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