On the effects of bath composition and ultrasound on structure and properties of Cu thin films

被引：0
|
作者：
Mallik, Archana [1 ]
Bankoti, A. K. S. [1 ]
Ray, B. C. [1 ]
机构：
[1] Natl Inst Technol, Dept Met & Mat Engn, Electromet & Corros Lab, Rourkela 769008, Orissa, India
来源：
RUSSIAN JOURNAL OF ELECTROCHEMISTRY | 2013年 / 49卷 / 02期
关键词：
copper; thin film; sono-electroplating; nucleation and growth; hardness; ELECTRODEPOSITION; TEMPERATURE; COPPER;
D O I：
10.1134/S1023193513020134
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Copper thin films were prepared by sono-electrodeposition method at different acid concentrations in the electrolyte. A potential of -450 mV (100 mV negative than the Nernst potential) was selected for the deposition procedure for all the conditions. The thickness of films was found to be in the range of 100-600 nm. Electrochemical analysis was performed by chronoamperometry. Films were characterized by XRD, SEM, AFM, and study of the mechanical properties was done by nanoindentation.
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收藏
页码：131 / 137
页数：7
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