Reliability studies of an isotropic electrically conductive adhesive

被引:7
|
作者
Morris, JE [1 ]
Anderssohn, F [1 ]
Kudtarkar, S [1 ]
Loos, E [1 ]
机构
[1] Portland State Univ, Dept Elect & Comp Engn, Portland, OR 97207 USA
来源
POLYTRONIC 2001, PROCEEDINGS | 2001年
关键词
D O I
10.1109/POLYTR.2001.973258
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
ICA reliability continues to be a source of concern for widespread practical implementations in commercial products. In addition, there is still much to be understood in the basic principles of how such materials function. This paper includes contributions in both areas, in further understanding of ICA size effects, in the interpretation of the beneficial effects of vacuum treatments before curing, with additional drop test data, and with critical comments on common electrical test techniques.
引用
收藏
页码:61 / 69
页数:9
相关论文
共 50 条
  • [1] Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints
    Wickham, Martin
    Zou, Ling
    Hunt, Christopher
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2009, 21 (04) : 12 - 18
  • [2] A Highly Conductive Bimodal Isotropic Conductive Adhesive and Its Reliability
    Li, Dongsheng
    Cui, Huiwang
    Chen, Si
    Fan, Qiong
    Yuan, Zhichao
    Ye, Lilei
    Liu, Johan
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011, 34 (01): : 583 - 588
  • [3] Study on Isotropic Electrically Conductive Adhesive for Medical Device Applications
    Shi, Shawn
    Sleeper, Scott
    Kim, Chunho
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 263 - 270
  • [4] Study on the Reliability of Fast Curing Isotropic Conductive Adhesive
    Du, Wenhui
    Cui, Huiwang
    Chen, Si
    Yuan, Zhichao
    Ye, Lilei
    Liu, Johan
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011, 34 (01): : 805 - 810
  • [5] Study into High Temperature Reliability of Isotropic Conductive Adhesive
    Du, Wenhui
    Cui, Huiwang
    Chen, Si
    Yuan, Zhichao
    Ye, Lilei
    Liu, Johan
    2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 1053 - 1055
  • [6] Adhesive is electrically conductive
    Modern Plastics, 1998, 75 (01):
  • [7] Reliability of Isotropic Electrically Conductive Adhesives under Condensing Humidity Testing
    Frisk, Laura
    Lahokallio, Sanna
    Mostofizadeh, Milad
    Kiilunen, Janne
    Saarinen, Kirsi
    PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 174 - 179
  • [8] Low-tech studies of isotropic electrically conductive adhesives
    Morris, JE
    Anderssohn, F
    Loos, E
    Liu, J
    26TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, CONFERENCE PROCEEDINGS: INTEGRATED MANAGEMENT OF ELECTRONIC MATERIALS PRODUCTION, 2003, : 90 - 94
  • [9] Electrically conductive polyaniline adhesive
    Pietilä, M
    Mäkelä, T
    Levon, K
    Kivilahti, J
    Isotalo, H
    4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS, 2000, : 118 - 120
  • [10] Reliability Study of Isotropic Electrically Conductive Adhesives under Thermal Cycling Testing
    Frisk, Laura
    Lahokallio, Sanna
    Mostofizadeh, Milad
    Kiilunen, Janne
    Saarinen, Kirsi
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 1794 - 1799