Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles

被引：72

作者：

Morita, Toshiaki ^{[1
]}

Yasuda, Yusuke ^{[1
]}

Ide, Eiichi ^{[1
]}

Akada, Yusuke ^{[2
]}

Hirose, Akio ^{[2
]}

机构：

[1] Hitachi Ltd, Mat Res Lab, Hitachi, Ibaraki 3191292, Japan

[2] Osaka Univ, Div Mat & Mfg Sci, Suita, Osaka 5650871, Japan

来源：

MATERIALS TRANSACTIONS | 2008年 / 49卷 / 12期

关键词：

silver oxide; reduction; nanoparticle; bonding technique; epitaxial growth;

D O I：

10.2320/matertrans.MRA2008269

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We investigated a new bonding utilizing micro-scaled silver-oxide (Ag2O) particles. The results of our investigations revealed that bonding between electrodes using for semiconductor modules can be accomplished by adding myristyl alcohol to silver-oxide particles, followed by heating the mixture in air 300 degrees C under a pressure of 2.5 MPa. Since this bonding technique produces silver particles with a size of a few nanometers when the silver oxide is reduced by the presence of the alcohol, low-temparature sintering and bonding can be achieved. [doi: 10.2320/matertrans.MRA2008269]

引用

页码：2875 / 2880

页数：6

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