Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application

被引：0

作者：

Wang, Shouxu ^{[1
]}

Chen, Yunzhao ^{[1
]}

Zheng, Li ^{[1
]}

Chen, Yuanming ^{[1
]}

Zhang, Huaiwu ^{[1
]}

Gong, Lijun ^{[2
]}

Chen, Bei ^{[2
]}

He, Wei ^{[1
,3
]}

机构：

[1] Univ Elect Sci & Technol China, State Ley Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China

[2] Guangzhou Fastprint Circuit Tech Co Ltd, Guangzhou 510663, Guangdong, Peoples R China

[3] Guangdong GuanghuaSci Tech Co Ltd, Res & Dev Dept, Shantou 515000, Peoples R China

来源：

PROCEEDINGS OF 2016 INTERNATIONAL CONFERENCE ON MODELING, SIMULATION AND OPTIMIZATION TECHNOLOGIES AND APPLICATIONS (MSOTA2016) | 2016年 / 58卷

关键词：

printed circuit board; ball grid array; simulation; drop;

D O I：

暂无

中图分类号：

C93 [管理学]; O22 [运筹学];

学科分类号：

070105 ; 12 ; 1201 ; 1202 ; 120202 ;

摘要：

In this paper, finite element analysis was carried out to simulate the response of printed circuit board (PCB) assembly that fell and collided with a rigid surface using dropping simulation. The drop process was simulated by setting the drop parameters including falling directions and falling heights. The results revealed that 180 degrees drop had the most severe damage for BGA solder joints. It also indicated that dynamic bending of the PCB resulted from the solder stress.

引用

页码：477 / 479

页数：3

共 5 条

[1] Package to board interconnection shear strength (PBISS): Effect of surface finish, PWB build-up layer and chip scale package structure [J].

Canumalla, S ;

Yang, HD ;

Viswanadham, P ;

Reinikainen, TO .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2004, 27 (01) :182-190

[2] Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition [J].

Chen, Yuanming ;

He, Wei ;

Chen, Xianming ;

Wang, Chong ;

Tao, Zhihua ;

Wang, Shouxu ;

Zhou, Guoyun ;

Moshrefi-Torbati, Mohamed .

ELECTROCHIMICA ACTA, 2014, 120 :293-301

[3]

Jing-en Luan, 2005, 2005 6th International Conference on Electronics Packaging Technology (IEEE Cat. No. 05EX1194), P382, DOI 10.1109/ICEPT.2005.1564714

[4]

Sarvar F., 1998, IEEE Transactions on Components, Packaging & Manufacturing Technology, Part C (Manufacturing), V21, P126, DOI 10.1109/3476.681389

[5] The effect of different build-up structures on solder joint fatigue life under thermo-mechanical cyclic loading condition [J].

Wang, JJ ;

Quander, S .

6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, :330-334

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