Underfill of flip chip on laminates: Simulation and validation

被引：71
作者：
Nguyen, L [1 ]
Quentin, C
Fine, P
Cobb, B
Bayyuk, S
Yang, H
Bidstrup-Allen, SA
机构：
[1] Natl Semicond Corp, Santa Clara, CA 95052 USA
[2] CFD Res Corp, Huntsville, AL 35805 USA
[3] Georgia Inst Technol, Atlanta, GA 30332 USA
来源：
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 1999年 / 22卷 / 02期
基金：
美国国家科学基金会;
关键词：
capillary flow; filler settling; flip chip; flow simulation; flow streaking; full array pattern; mixed array pattern; organic laminates; peripheral pattern; quartz dies; underfill flow;
D O I：
10.1109/6144.774725
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The how characteristics of a number of underfills were evaluated with quartz dies of different patterns and pitches bonded on different substrate surfaces, Perimeter, mixed array, and full array patterns were tested, Observations on the dow front uniformity, streaking, voiding, and filler segregation were collected. The information was compared with the results predicted by a new simulation code, plastic integrated circuit encapsulation-computer aided design (PLICE-CAD) under DARPA-funded development. The two-phase model of the combined resin and air takes into account geometrical factors such as bumps and die edges, together with boundary conditions in order to track accurately the propagation of the how fronts. The two-phase flow field is based on the volume-of-fluid (VOF) methodology embedded in a general-purpose three-dimensional (3-D) flow solver.
引用
收藏
页码：168 / 176
页数：9
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