Experiment on Evaporation Heat Transfer Performance of Porous Surface

被引：0

作者：

Hirasawa, Shigeki ^{[1
]}

Nakajima, Takuya ^{[1
]}

Urimoto, Tetsuya ^{[1
]}

Tsujimoto, Yuya ^{[1
]}

Takeuchi, Yusuke ^{[1
]}

Kawanami, Tsuyoshi ^{[1
]}

Shirai, Katsuaki ^{[1
]}

机构：

[1] Kobe Univ, Dept Mech Engn, Nada Ku, 1-1 Rokkodai, Kobe, Hyogo 6578501, Japan

来源：

2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM) | 2016年

关键词：

evaporation; pool boiling; heat transfer coefficient; porous surface; cross-grooved surface; thin glass-beads layer; dry portion; cooling electronic devices; TRANSFER COEFFICIENT; FILM;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with microchannel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8x10(4) W/m(2)K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m(2)K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m(2)K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.

引用

页码：1 / 5

页数：5

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