Investigation on Carrier Transport Through AIN Nucleation Layer From Differently Doped Si(111) Substrates

被引:37
作者
Li, Xiangdong [1 ,2 ]
Van Hove, Marleen [1 ]
Zhao, Ming [1 ]
Bakeroot, Benoit [1 ,3 ]
You, Shuzhen [1 ]
Groeseneken, Guido [1 ,2 ]
Decoutere, Stefaan [1 ]
机构
[1] IMEC, B-3001 Leuven, Belgium
[2] Katholieke Univ Leuven, Dept Elect Engn, B-3001 Leuven, Belgium
[3] Univ Ghent, Ctr Microsyst Technol, B-9052 Ghent, Belgium
关键词
AlN/Si; depletion; leakage mechanism; Ohm's law; space-charge-limited conduction (SCLC); trap-assisted tunneling (TAT); variable-range hopping (VRH); POWER DEVICES; GAN; TRANSISTORS; MECHANISMS; CONDUCTION; BREAKDOWN; DIODES; TRAPS;
D O I
10.1109/TED.2018.2810886
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
To get a better insight into the vertical leakage mechanism of GaN-on-Si, the carrier transport from n(+), n, p(+), and p-Si(111) substrates through the AIN nucleation layer was investigated. A plateau in the current-voltage curve was found only for the AIN/p-Si heterojunction due to depletion of the p-Si substrate. Detailed study illustrated that it was the leaky AIN that cannot effectively block the increasing amount of electrons in the inversion layer at the interface and triggered the depletion. Temperature-dependent characterization suggested that the forward vertical leakage mechanism of AIN/Si could be explained sequentially by Ohm's law, space-charge-limited conduction, variable-range hopping, and trap-assisted tunneling. A model involving shallow donor traps, interface traps, and deep level traps was proposed to explain the leakage characteristics. This paper shows that the carrier concentration of the Si substrates strongly impacts the vertical leakage characteristics, and also that the carrier transport from the Si substrate through the AIN nucleation layer is heavily influenced by traps.
引用
收藏
页码:1721 / 1727
页数:7
相关论文
共 36 条
  • [1] [Anonymous], IEDM
  • [2] [Anonymous], 2015, PALACIOS 2015 61 IEE
  • [3] Evidence of Time-Dependent Vertical Breakdown in GaN-on-Si HEMTs
    Borga, Matteo
    Meneghini, Matteo
    Rossetto, Isabella
    Stoffels, Steve
    Posthuma, Niels
    Van Hove, Marleen
    Marcon, Denis
    Decoutere, Stefaan
    Meneghesso, Gaudenzio
    Zanoni, Enrico
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (09) : 3609 - 3614
  • [4] Direct observation of localized high current densities in GaN films
    Brazel, EG
    Chin, MA
    Narayanamurti, V
    [J]. APPLIED PHYSICS LETTERS, 1999, 74 (16) : 2367 - 2369
  • [6] Cornigli D., 2015, IEDM, DOI [10.1109/IEDM.2015.7409633, DOI 10.1109/IEDM.2015.7409633]
  • [7] TCAD analysis of the leakage current and breakdown versus temperature of GaN-on-Silicon vertical structures
    Cornigli, Davide
    Monti, Federico
    Reggiani, Susanna
    Gnani, Elena
    Gnudi, Antonio
    Baccarani, Giorgio
    [J]. SOLID-STATE ELECTRONICS, 2016, 115 : 173 - 178
  • [8] Capacitance and conductance characteristics of silicon nanocrystal metal-insulator-semiconductor devices
    Flynn, C.
    Koenig, D.
    Perez-Wurfl, I.
    Conibeer, G.
    Green, M. A.
    [J]. SOLID-STATE ELECTRONICS, 2009, 53 (05) : 530 - 539
  • [9] Goldberg Y., 2001, PROPERTIES ADV SEMIC, P31
  • [10] GREEN MA, 1975, J APPL PHYS, V46, P5185, DOI 10.1063/1.321583