A Survey on Defect Detection in Bare PCB and Assembled PCB using Image Processing Techniques

被引：0

作者：

Anitha, D. B. ^{[1
]}

Rao, Mahesh ^{[2
]}

机构：

[1] Vidya Vikas Inst Engn & Technol, Elect & Commun Dept, Mysore, Karnataka, India

[2] Maharaja Inst Technol Mysore, Elect & Commun Dept, Mysore, Karnataka, India

来源：

2017 2ND IEEE INTERNATIONAL CONFERENCE ON WIRELESS COMMUNICATIONS, SIGNAL PROCESSING AND NETWORKING (WISPNET) | 2017年

关键词：

Defect detection; image processing techniques; printed circuit board; PRINTED-CIRCUIT BOARDS; INSPECTION;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In recent years, the development of low cost consumer electronic products such as television, mobile, washing machine etc. make high demands on manufacturing of defect free Printed Circuit Board and Printed Circuit Board Assembly. Therefore, it is necessary to know the different types of defects and defect detection techniques of Printed Circuit Board in order to produce high quality zero defect printed circuit boards. This paper discusses various methods which have been used in detecting defects so as to understand the gaps which would be helpful for the researchers to do the future work related to defect detection.

引用

页码：39 / 43

页数：5

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