Metal-Insulator-Si Hybrid Plasmonic Waveguide Components for On-Chip Photonics

Vertical Cu-SiO2-Si hybrid plasmonic components are experimentally demonstrated on a SOI platform using standard CMOS technology. The hybrid plasmonic waveguide (HPW) exhibits relatively low propagation loss of similar to 0.12 dB/mu m and high coupling efficiency of similar to 86% with the conventional Si waveguides. The plasmonic waveguide-ring resonator with a compact radius of 1.59 mu m exhibits high performance such as large extinction ratio of similar to 18 dB, small bandwidth of similar to 4 nm, and large free spectral range of similar to 74 nm. These superior performances as well as the fully CMOS compatibility make them promising building blocks for silicon electronic-photonic integrated circuits for data communications and sensing applications.