Active crosstalk cancel for high-density inductive inter-chip wireless communication

被引:0
作者
Kumar, A [1 ]
Miura, N [1 ]
Muqsith, M [1 ]
Kuroda, T [1 ]
机构
[1] Keio Univ, Dept Elect & Elect Engn, Keio, Japan
来源
19TH INTERNATIONAL CONFERENCE ON VLSI DESIGN, PROCEEDINGS | 2005年
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A 1.2Gb/s/channel inductive inter-chip wireless interconnect is reported in ISSCC 2004. For high data bandwidth in this scheme, high density inductor layout is required, but closer layout of inductors on chip also increases the crosstalk between channels. In this paper a theory is introduced to reduce the crosstalk between wireless channels based on the inverse matrix, which in turn helps in reducing the pitch of the inductor layout. The simulations were done for a communication distance of 15 mu m and for varying If inductor pitch layout from 10 mu m to 50 mu m. Simulink simulations show that for the some Signal to Noise Ratio (SNR) the Bit Error Rate (BER) can be improved for the given pitch. Circuit implementations are proposed and Spice simulations show that the pitch of the inductor layout can be decreased only with the help of change in layout from 25 mu m to 15 mu m for SNR of 15db.
引用
收藏
页码:271 / 276
页数:6
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