Modeling TCAM power for next generation network devices

被引:0
作者
Agrawal, Banit [1 ]
Sherwood, Timothy [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Comp Sci, Santa Barbara, CA 93106 USA
来源
ISPASS 2006: IEEE INTERNATIONAL SYMPOSIUM ON PERFORMANCE ANALYSIS OF SYSTEMS AND SOFTWARE | 2006年
关键词
CAM; ternary CAM; TCAM; SRAM; power; modeling; router; network algorithms;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Applications in Computer Networks often require high throughput access to large data structures for lookup and classification. Many advanced algorithms exist to speed these search primitives on network processors, general purpose machines, and even custom ASICs. However supporting these applications with standard memories requires very careful analysis of access patterns, and achieving worst case performance can be quite difficult and complex. A simple solution is often possible if a Ternary CAM is used to perform a fully parallel search across the entire data set. Unfortunately, this parallelism means that large portions of the chip are switching during each cycle, causing large amounts of power to be consumed. While researchers have begun to explore new ways of managing the power consumption, quantifying design alternatives is difficult due to a lack of available models. In this paper we examine the structure inside a modern TCAM and present a simple, yet accurate, power model. We present techniques to estimate the dynamic power consumption of a large TCAM. We validate the model using industrial TCAM datasheets and prior published works. We present an extensive analysis of the model by varying various architectural parameters. We also describe how new network algorithms have the potential to address the growing problem of power management in next-generation network devices.
引用
收藏
页码:120 / +
页数:2
相关论文
共 50 条
  • [21] Characteristics and modeling of harmonic sources - Power electronic devices
    Burch, R
    Chang, G
    Dwyer, R
    Grady, M
    Halpin, M
    Hatziadoniu, C
    Liu, Y
    Marz, M
    Medina, A
    Middledanff, S
    Natarajan, R
    Nguyen, H
    Ortmeyer, T
    Ranade, S
    Ribeiro, P
    Ruthman, D
    Sims, T
    Watson, N
    Wikston, J
    Xu, W
    IEEE TRANSACTIONS ON POWER DELIVERY, 2001, 16 (04) : 791 - 800
  • [22] EMTP Modeling of Protective Devices for Distribution Systems with Distributed Generation
    Martinez, Juan A.
    Martin-Arnedo, Jacinto
    IEEE POWER AND ENERGY SOCIETY GENERAL MEETING 2010, 2010,
  • [23] System Modeling and Design Optimization for a Next-Generation Unattended Sensor
    McDonald, Benjamin S.
    Myjak, Mitchell J.
    Hensley, Walter K.
    Smart, John E.
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2013, 60 (02) : 1102 - 1106
  • [24] Dynamic Power Reduction in TCAM Using Advanced Selective Pre-Charging of Match Lines
    Doo, Su-Yeon
    Kwon, Kee-Won
    ELECTRONICS, 2023, 12 (17)
  • [26] Dispatch modeling of a regional power generation system - Integrating wind power
    Goransson, Lisa
    Johnsson, Filip
    RENEWABLE ENERGY, 2009, 34 (04) : 1040 - 1049
  • [27] Review on Research of Modeling and Simulation for Wind Power Generation in Power System
    Hong, Guoqing
    Wu, Guoyang
    Jin, Yuqing
    Xie, Huan
    Ju, Ping
    Liang, Beihua
    Dianli Xitong Zidonghua/Automation of Electric Power Systems, 2024, 48 (17): : 22 - 36
  • [28] Low Leakage Mask Vertical Control TCAM for Network Router
    Cheng, Yu-Cheng
    Chen, Jin-Hao
    Wu, Tung-Chi
    Chang, Yen-Jen
    2016 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS (APCCAS), 2016, : 469 - 472
  • [29] Artificial Neural Network-Based (ANN) Approach for Characteristics Modeling and Prediction in GaN-on-Si Power Devices
    Bin Kutub, Sayeem
    Jiang, Hong-Jia
    Chen, Nan-Yow
    Lee, Wen-Jay
    Jui, Chia-Yung
    Wu, Tian-Li
    PROCEEDINGS OF THE 2020 32ND INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD 2020), 2020, : 529 - 532
  • [30] Energy Efficient and Low dynamic power Consumption TCAM on FPGA
    Vadivel, Sridhar Raj Sankara
    Ramapackiam, Shantha Selvakumari
    INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 2022, 52 (03): : 181 - 189