Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

被引：175

作者：

Wu, Tzong-Lin ^{[1
,2
]}

Buesink, Frits ^{[3
]}

Canavero, Flavio ^{[4
]}

机构：

[1] Natl Taiwan Univ, Dept Elect Engn, Taipei 10617, Taiwan

[2] Natl Taiwan Univ, Grad Inst Commun Engn, Taipei 10617, Taiwan

[3] Univ Twente, Fac Telecommun Engn, NL-7522 NH Enschede, Netherlands

[4] Politecn Torino, Dipartimento Elettron & Telecomunicaz, I-10129 Turin, Italy

来源：

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 2013年 / 55卷 / 04期

关键词：

Circuit demonstrator; crosstalk; differential signaling; eye diagram; macromodeling; mode conversion; paramter variability; PCB; polynomial chaos; practical training; signal integrity; TDR; trace discontinuity; COMMON-MODE SUPPRESSION; FULL-WAVE CHARACTERIZATION; PASSIVE EQUALIZER DESIGN; MACRO-PI MODELS; LOW-POWER; RATIONAL APPROXIMATION; BEND DISCONTINUITIES; LARGE NUMBER; TIME; ALGORITHM;

D O I：

10.1109/TEMC.2013.2257796

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.

引用

页码：624 / 638

页数：15

共 22 条

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