Mechanism of fluorine reduction in C4F8/Ar parallel-plate-type electron-cyclotron-resonance plasma by a Si top plate

被引:8
|
作者
Hayashi, H [1 ]
Okigawa, M [1 ]
Morishita, S [1 ]
Sekine, M [1 ]
机构
[1] Assoc Super Adv Elect Technol, Totsuka Ku, Yokohama, Kanagawa 2440817, Japan
关键词
D O I
10.1116/1.581990
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The density of F in C4F8/Ar plasma could be reduced by 34% when the Si top plate was bombarded by energetic ions in a parallel-plate-type 500 MHz electron-cyclotron-resonance plasma reactor, but that in CF4/Ar plasma was not reduced. We measured the densities of CFx (x = 1 - 3), Si, and F in both plasmas as a function of ion-bombardment energy and found that F was generated from CF2 in C4F8/Ar plasma but not in CF4/Ar plasma, and that the CF2 density decreased ts a similar extent with increasing ion-bombardment energy in both plasmas. We conclude that the reduction of the F density in C4F8/Ar plasma was caused by the decrease in CF2 density and not by a direct reaction of F with Si when the Si plate was irradiated by energetic ions. (C) 1999 American Vacuum Society. [S0734-2101(99)01005-2].
引用
收藏
页码:2517 / 2524
页数:8
相关论文
共 31 条
  • [31] Selective etching of HfO2 by using inductively-coupled Ar/C4F8 plasmas and the removal of etch residue on Si by using an O2 plasma treatment
    Min, K. S.
    Park, B. J.
    Kim, S. W.
    Kang, S. K.
    Yeom, G. Y.
    Heo, S. H.
    Hwang, H. S.
    Kang, C. Y.
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2008, 53 (03) : 1675 - 1679