Mechanism of fluorine reduction in C4F8/Ar parallel-plate-type electron-cyclotron-resonance plasma by a Si top plate

被引:8
|
作者
Hayashi, H [1 ]
Okigawa, M [1 ]
Morishita, S [1 ]
Sekine, M [1 ]
机构
[1] Assoc Super Adv Elect Technol, Totsuka Ku, Yokohama, Kanagawa 2440817, Japan
关键词
D O I
10.1116/1.581990
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The density of F in C4F8/Ar plasma could be reduced by 34% when the Si top plate was bombarded by energetic ions in a parallel-plate-type 500 MHz electron-cyclotron-resonance plasma reactor, but that in CF4/Ar plasma was not reduced. We measured the densities of CFx (x = 1 - 3), Si, and F in both plasmas as a function of ion-bombardment energy and found that F was generated from CF2 in C4F8/Ar plasma but not in CF4/Ar plasma, and that the CF2 density decreased ts a similar extent with increasing ion-bombardment energy in both plasmas. We conclude that the reduction of the F density in C4F8/Ar plasma was caused by the decrease in CF2 density and not by a direct reaction of F with Si when the Si plate was irradiated by energetic ions. (C) 1999 American Vacuum Society. [S0734-2101(99)01005-2].
引用
收藏
页码:2517 / 2524
页数:8
相关论文
共 31 条
  • [1] Mechanism of C4F8 dissociation in parallel-plate-type plasma
    Hayashi, H
    Morishita, S
    Tatsumi, T
    Hikosaka, Y
    Noda, S
    Nakagawa, H
    Kobayashi, S
    Inoue, M
    Hoshino, T
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1999, 17 (05): : 2557 - 2571
  • [2] Determination of negative-ion density in an electron cyclotron resonance C4F8 plasma
    Kyushu Univ, Fukuoka, Japan
    Surf Coat Technol, (1065-1069):
  • [3] Determination of negative-ion density in an electron cyclotron resonance C4F8 plasma
    Shindo, M
    Hiejima, S
    Ueda, Y
    Kawakami, S
    Ishii, N
    Kawai, Y
    SURFACE & COATINGS TECHNOLOGY, 1999, 116 : 1065 - 1069
  • [4] Characteristics of parallel-plate RF discharges in C4F8 gas and C4F8/O-2 mixtures
    Aoyagi, K
    Ishikawa, I
    Nagaseki, K
    Hirose, Y
    Saito, Y
    Suganomata, S
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1997, 36 (08): : 5286 - 5289
  • [5] Characteristics of parallel-plate RF discharges in C4F8 gas and C4F8/O2 mixtures
    Yamanashi Univ, Kofu, Japan
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1997, 36 (08): : 5286 - 5289
  • [6] Kinetics of radicals in CF4 and C4F8 electron cyclotron resonance plasmas
    Miyata, K
    Hori, M
    Goto, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1997, 36 (08): : 5340 - 5345
  • [7] SiO2 etching in C4F8/O2 electron cyclotron resonance plasma
    Siozawa, Ken-itiro
    Tabaru, Kenji
    Maruyama, Takahiro
    Fujiwara, Nobuo
    Yoneda, Masahiro
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1996, 35 (4 B): : 2483 - 2487
  • [8] Kinetics of radicals in CF4 and C4F8 electron cyclotron resonance plasmas
    Nagoya Univ, Nagoya, Japan
    Jpn J Appl Phys Part 1 Regul Pap Short Note Rev Pap, 8 (5340-5345):
  • [9] SiO2 etching in C4F8/O-2 electron cyclotron resonance plasma
    Siozawa, KI
    Tabaru, K
    Maruyama, T
    Fujiwara, N
    Yoneda, M
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (4B): : 2483 - 2487
  • [10] Mechanism of selective SiO2/Si etching with fluorocarbon gases (CF4, C4F8) and hydrogen mixture in electron cyclotron resonance plasma etching system
    Doh, HH
    Kim, JH
    Lee, SH
    Whang, KW
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1996, 14 (05): : 2827 - 2834