Mechanical properties of TaN-Cu nanocomposite thin films

被引：22

作者：

Hsieh, J. H. ^{[1
]}

Liu, P. C. ^{[1
]}

Li, C. ^{[2
]}

Cheng, M. K. ^{[1
]}

Chang, S. Y. ^{[3
]}

机构：

[1] Mingchi Univ Technol, Dept Mat Engn, Taipei 24301, Taiwan

[2] Nanyang Technol Univ, Sch MAE, Singapore 639798, Singapore

[3] Natl Chung Hsing Univ, Dept Mat Sci & Engn, Taichung 402, Taiwan

来源：

SURFACE & COATINGS TECHNOLOGY | 2008年 / 202卷 / 22-23期

关键词：

Co-sputtering; Nanocomposite thin films; TaN-Cu; Annealing;

D O I：

10.1016/j.surfcoat.2008.06.131

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

TaN-Cu nanocomposite films were deposited by reactive co-sputtering on tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 400 degrees C for 2, 4, 8 min respectively to induce the nucleation and growth of Cu particles in the TaN matrix and on the film surface. Indentation method was used to examine the mechanical properties of these films. The results confirm that annealing by RTA can cause Cu nano-particles with various dimensions to form on and in the TaN matrix. Consequently, hardness and toughness will change depending on annealing conditions, Cu content, and/or Cu particle density. The strengthening and toughening mechanisms are discussed. (C) 2008 Elsevier B.V. All rights reserved.

引用

页码：5530 / 5534

页数：5

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