Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test

被引：9
作者：
Kang, Min-Soo [1 ]
Jeon, Yu-Jae [2 ]
Kim, Do-Seok [1 ]
Shin, Young-Eui [1 ]
机构：
[1] Chung Ang Univ, Sch Mech Engn, Seoul 156756, South Korea
[2] Yeoju Inst Technol, Dept Automot, Gyeonggi Do 12652, South Korea
来源：
ENERGIES | 2017年 / 10卷 / 04期
关键词：
electroluminescence (EL); dark rectangular (DR); broken finger ratio (BFR); 60Sn40Pb (SP); 60Sn2Ag38Pb (SAP); SILICON SOLAR-CELLS; ELECTROLUMINESCENCE; EVOLUTION; TEMPERATURE; DEGRADATION;
D O I：
10.3390/en10040529
中图分类号：
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号：
0807 ; 0820 ;
摘要：
In this study, the characteristics of a photovoltaic (PV) ribbon (t = 0.25 mm) joint with 60Sn40Pb and 62Sn2Ag36Pb solders were evaluated using thermal shock tests. The thermal shock tests were performed under three conditions: 40-65 degrees C, 40-85 degrees C, and 40-105 degrees C. The results of these tests were analyzed using electroluminescence (EL) and cross-sectional images. Following testing, broken metal fingers (MFs) were confirmed near the solder joint. PV module degradation was attributed to the broken finger ratio (BFR) based on quantitative analysis of the dark rectangular (DR) regions on the EL images. In addition, the activation energy of the broken MFs was calculated from the increasing BFR. Thermal characteristic variations due to the added Ag in the PV ribbon solder joints were evaluated through observation of solder micro-structure changes following thermal shock tests.
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页数：11
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