Pervasive liquid metal printed electronics: From concept incubation to industry

被引:41
作者
Chen, Sen [1 ,2 ,3 ]
Liu, Jing [1 ,2 ,3 ,4 ]
机构
[1] Chinese Acad Sci, Tech Inst Phys & Chem, Beijing Key Lab Cryobiomed Engn, Beijing 100190, Peoples R China
[2] Univ Chinese Acad Sci, Sch Future Technol, Beijing 100039, Peoples R China
[3] Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China
[4] Tsinghua Univ, Dept Biomed Engn, Sch Med, Beijing 100084, Peoples R China
关键词
FAST FABRICATION; POLYMER; INK; ALLOY; AREA; FILM;
D O I
10.1016/j.isci.2020.102026
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
Electronic devices play vital role in modern civilization. Compared to conventional electronic manufacturing, the recently emerging liquid metal printed electronics (LMPE) is opening many extraordinary opportunities, such as large- area printing, pervasive adaptability, flexibility for personal use, low cost, high performance, and environmental friendliness. More uniquely, liquid metal printing allows customize electronic products on demand to fabricate electronics spanning from 2D plane surface to 3D structure and on any desired substrates. This deems it to reshape modern electronics and integrated circuits field. So far, a variety of technological breakthroughs in this new generation electronic engineering area have been made in the process of developing various liquid metal functional inks, printing machines and applications, which significantly stimulate the quick incubation and formation of a new electronic industry. Clearly, sorting out themajor R&D directions and clarifying future challenges is crucial for the large scale industrialization of LMPE. This perspective article is dedicated to briefly outline the representative principles and key technologies lying behind, and illustrate the milestone products and equipment thus invented for the coming LMPE industry. In addition, we evaluate the corresponding industrialization trends and promising roadmap and interpret future prospects for the new era of pervasive electronics when anyone can freely use such a tool to print out himself functional electronic device to fulfill various purposes at anywhere and anytime.
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页数:15
相关论文
共 96 条
[41]  
Liu J, 2019, TOP MINING METAL MAT, P1, DOI 10.1007/978-981-13-2709-4
[42]  
Liu J., 2011, China Patent, Patent No. 2011101401566
[43]  
Liu J., 2002, China Patent, Patent No. 2131419
[44]   Laser Sintering of Liquid Metal Nanoparticles for Scalable Manufacturing of Soft and Flexible Electronics [J].
Liu, Shanliangzi ;
Yuen, Michelle C. ;
White, Edward L. ;
Boley, J. William ;
Deng, Biwei ;
Cheng, Gary J. ;
Kramer-Bottiglio, Rebecca .
ACS APPLIED MATERIALS & INTERFACES, 2018, 10 (33) :28232-28241
[45]   Development of Graphene Oxide/Polyaniline Inks for High Performance Flexible Microsupercapacitors via Extrusion Printing [J].
Liu, Yuqing ;
Zhang, Binbin ;
Xu, Qun ;
Hou, Yuyang ;
Seyedin, Shayan ;
Qin, Si ;
Wallace, Gordon G. ;
Beirne, Stephen ;
Razal, Joselito M. ;
Chen, Jun .
ADVANCED FUNCTIONAL MATERIALS, 2018, 28 (21)
[46]   Electrochemically enabled manipulation of gallium-based liquid metals within porous copper [J].
Ma, Jin-Lei ;
Dong, Hao-Xuan ;
He, Zhi-Zhu .
MATERIALS HORIZONS, 2018, 5 (04) :675-682
[47]   Nano liquid-metal fluid as ultimate coolant [J].
Ma, Kun-Quan ;
Liu, Jing .
PHYSICS LETTERS A, 2007, 361 (03) :252-256
[48]   Liquid metal cooling in thermal management of computer chips [J].
Ma K. ;
Liu J. .
Frontiers of Energy and Power Engineering in China, 2007, 1 (4) :384-402
[49]   An autonomously electrically self-healing liquid metal-elastomer composite for robust soft-matter robotics and electronics [J].
Markvicka, Eric J. ;
Bartlett, Michael D. ;
Huang, Xiaonan ;
Majidi, Carmel .
NATURE MATERIALS, 2018, 17 (07) :618-+
[50]   Thermally induced porous structures in printed gallium coating to make transparent conductive film [J].
Mei, Shengfu ;
Gao, Yunxia ;
Li, Haiyan ;
Deng, Zhongshan ;
Liu, Jing .
APPLIED PHYSICS LETTERS, 2013, 102 (04)