Thermal Analysis for Silicon-based Integration of LED Systems

被引：0
|
作者：
Dong, Mingzhi [1 ,4 ]
Santagata, Fabio [1 ,4 ]
Wei, Jia [1 ,4 ]
Yuan, Cadmus [2 ,4 ]
Zhang, Kouchi [2 ,3 ]
机构：
[1] Delft Univ Technol, Beijing Res Ctr, Beijing, Peoples R China
[2] Chinese Acad Sci, Inst Semicond, Beijing, Peoples R China
[3] Delft Univ Technol, DIMES, Delft, Netherlands
[4] State Key Lab Solid State Lighting, Beijing, Peoples R China
来源：
2013 10TH CHINA INTERNATIONAL FORUM ON SOLID STATE LIGHTING (CHINASSL) | 2013年
关键词：
LIGHT-EMITTING DIODE;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Silicon interposer is an emerging and promlsmg technology for 3D integration of LED systems. In this paper, the thermal performance of silicon interposer is investigated through finite element analysis (FE A). Different approaches of silicon integration are evaluated: double-side interposer and double-layer interposer. The effect of thermal interface material (TIM) on the junction temperature of LEDs is investigated. Some design recommendations are also provided within this paper.
引用
收藏
页码：206 / 209
页数：4
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