Measurement of spatial stress gradients near grain boundaries

被引：22
作者：
Basu, Indranil [1 ]
Ocelik, Vaclav
De Hosson, Jeff Th. M.
机构：
[1] Univ Groningen, Zernike Inst Adv Mat, Dept Appl Phys, NL-9747 AG Groningen, Netherlands
来源：
SCRIPTA MATERIALIA | 2017年 / 136卷
关键词：
ELECTRON BACKSCATTER DIFFRACTION; DISLOCATION DENSITY; RESIDUAL-STRESS; FIELDS; STRAIN; 3D;
D O I：
10.1016/j.scriptamat.2017.03.036
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
A correlative method based on electron back scattered diffraction and focused ion-beam-digital image correlation slit milling technique was used to quantitatively determine spatially resolved stress profiles in the vicinity of grain boundaries in pure titanium. Measured local stress gradients were in good agreement with local average misorientation and experimentally calculated geometrically necessary dislocation densities. Stress profiles within few hundred to thousand nanometers near the grain boundary display a local minimum, followed by a typical Hall-Petch type variation of "one over square root of distance". The observed trends allude to local stress relaxation mechanisms active near grain boundaries. (C) 2017 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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收藏
页码：11 / 14
页数：4
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