An evaluation of low-cycle fatigue property for Sn-3.5Ag and Sn-0.7Cu lead-free solders using surface deformation

被引：1
|
作者：
Takahashi, Takehiko [1 ]
Hioki, Susumu [1 ]
Shohji, Ikuo [2 ]
Kamiya, Osamu [3 ]
机构：
[1] Akita Prefectural Univ, Fac Syst Sci & Technol, 84-4 Tsuchiya Ebinokuchi, Akita 0150055, Japan
[2] Gunma Univ, Fac Engn, Kiryu, Gumma 3768515, Japan
[3] Akita Univ, Fac Engn & Res Sci, Akita 0108502, Japan
来源：
EXPERIMENTAL MECHANICS IN NANO AND BIOTECHNOLOGY, PTS 1 AND 2 | 2006年 / 326-328卷
关键词：
lead-free solder; Sn-Ag; Sn-Cu; low-cycle fatigue; surface deformation; surface feature; image processing;
D O I：
10.4028/www.scientific.net/KEM.326-328.1035
中图分类号：
Q81 [生物工程学（生物技术）]; Q93 [微生物学];
学科分类号：
071005 ; 0836 ; 090102 ; 100705 ;
摘要：
The low-cycle fatigue behavior and the relationship between the surface features in the low-cycle fatigue testing and the fatigue life of Sn-3.5Ag and Sn-0.7Cu lead-free solders were investigated at strain I-ate of 0.1%/s at room temperature, 80 and 120 degrees C. In addition, the fatigue life was estimated by using the surface deformation of the solders, and image processing. And also, it was compared with Coffin-Manson type of fatigue behavior. The fatigue life of Sn-3.5Ag solder was Superior to that of Sn-0.7Cu solder at temperatures, 80 and 120 degrees C. The fatigue life determined by surface deformation indicated a close behavior to Coffin-Manson type fatigue behavior in those solders. Therefore the low-cycle fatigue life of solders could be estimated by the Surface deformation.
引用
收藏
页码：1035 / +
页数：2
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