A Novel Failure Response Policy for Single-arm Cluster Tools with Residency Time Constraints

被引：0
|
作者：
Qiao, Yan [1 ]
Wu, NaiQi [2 ]
Pan, ChunRong [3 ]
Zhou, MengChu [3 ]
机构：
[1] Guangdong Univ Technol, Sch Electromech Engn, Guangzhou 510006, Guangdong, Peoples R China
[2] Macau Univ Sci & Technol, Inst Syst Engn, Taipa, Macau, Peoples R China
[3] New Jersey Inst Technol, Dept ECE, Newark, NJ 07102 USA
来源：
2014 IEEE INTERNATIONAL CONFERENCE ON SYSTEMS, MAN AND CYBERNETICS (SMC) | 2014年
关键词：
Wafer fabrication; Cluster tools; Petri net; Scheduling; Failure response; SCHEDULING ANALYSIS; MULTICLUSTER TOOLS; EVENT GRAPH; PETRI NETS; SYSTEMS; MODEL;
D O I：
暂无
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
It is very challenging to schedule a residency time-constrained single-arm cluster tool with failure-prone process modules. In some cases, when a failure occurs, the degraded tool is not schedulable. However, it is highly desired to respond to a process module failure properly such that the tool can continue working and the wafers in the tool can be completed in a feasible way. Thus, in this paper, Petri net models are developed to describe the discrete-event behavior of a single-arm cluster tool. With the models, failure response policies are given to control the cluster tool such that it can keep working without violating any residency time constraints. They are implemented via efficient real-time control laws. Illustrative examples are presented to show their usage.
引用
收藏
页码：120 / 126
页数：7
相关论文
共 50 条
  • [31] Failure response policy for revisiting dual-arm cluster tools based on Petri nets
    Pan C.
    Fu J.
    Jisuanji Jicheng Zhizao Xitong/Computer Integrated Manufacturing Systems, CIMS, 2019, 25 (12): : 3235 - 3246
  • [32] Analysis of Wafer Sojourn Time in Dual-Arm Cluster Tools With Residency Time Constraint and Activity Time Variation
    Wu, NaiQi
    Zhou, MengChu
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2010, 23 (01) : 53 - 64
  • [33] Scheduling dual-arm cluster tools with multiple wafer types and residency time constraints
    Wang, Jipeng
    Hu, Hesuan
    Pan, Chunrong
    Zhou, Yuan
    Li, Liang
    IEEE-CAA JOURNAL OF AUTOMATICA SINICA, 2020, 7 (03) : 776 - 789
  • [34] Scheduling and Control of Start-up Process for Time-Constrained Single-Arm Cluster Tools with Parallel Chambers
    Yang, FaJun
    Qiao, Yan
    Gao, KaiZhou
    Wu, NaiQi
    Zhu, YuTing
    Simon, Ian Ware
    Su, Rong
    IFAC PAPERSONLINE, 2018, 51 (07): : 251 - 256
  • [35] Scheduling of Single-Arm Multi-Cluster Tools to Achieve the Minimum Cycle Time
    Zhu, QingHua
    Wu, NaiQi
    Qiao, Yan
    Zhou, MengChu
    2013 IEEE INTERNATIONAL CONFERENCE ON ROBOTICS AND AUTOMATION (ICRA), 2013, : 3555 - 3560
  • [36] An Efficient Scheduling Method for Single-Arm Cluster Tools With Multifunctional Process Modules
    Xiong, WenQing
    Li, Jie
    Qiao, Yan
    Bai, LiPing
    Huang, BaoYing
    Wu, NaiQi
    IEEE TRANSACTIONS ON SYSTEMS MAN CYBERNETICS-SYSTEMS, 2023, 53 (06): : 3270 - 3283
  • [37] Schedulability and scheduling of dual-arm cluster tools with residency time constraints based on Petri net
    Wu, Naiqi
    Zhou, MengChu
    2006 IEEE INTERNATIONAL CONFERENCE ON AUTOMATION SCIENCE AND ENGINEERING, VOLS 1 AND 2, 2006, : 87 - +
  • [38] Efficient Approach to Scheduling of Transient Processes for Time-Constrained Single-Arm Cluster Tools With Parallel Chambers
    Yang, FaJun
    Qiao, Yan
    Gao, KaiZhou
    Wu, NaiQi
    Zhu, YuTing
    Simon, Ian Ware
    Su, Rong
    IEEE TRANSACTIONS ON SYSTEMS MAN CYBERNETICS-SYSTEMS, 2020, 50 (10): : 3646 - 3657
  • [39] AN EFFECTIVE SCHEDULING METHOD TO SINGLE-ARM CLUSTER TOOLS FOR PROCESSING MULTIPLE WAFER TYPES
    Lu, Yanjun
    LI, Jie
    Qiao, Yan
    LI, Zhiwu
    Wu, Naiqi
    Pan, Chunrong
    JOURNAL OF INDUSTRIAL AND MANAGEMENT OPTIMIZATION, 2023, 19 (06) : 4450 - 4480
  • [40] Petri Net-Based Optimal One-Wafer Scheduling of Single-Arm Multi-Cluster Tools in Semiconductor Manufacturing
    Zhu, QingHua
    Wu, NaiQi
    Qiao, Yan
    Zhou, MengChu
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2013, 26 (04) : 578 - 591
12345