Design technology co-optimization assessment for directed self-assembly-based lithography: design for directed self-assembly or directed self-assembly for design?

被引:10
|
作者
Lai, Kafai [1 ]
Liu, Chi-Chun [1 ]
Tsai, Hsinyu [1 ]
Xu, Yongan [1 ]
Chi, Cheng [1 ]
Raghunathan, Ananthan [2 ]
Dhagat, Parul [2 ]
Hu, Lin [2 ]
Park, Oseo [2 ]
Jung, Sunggon [3 ]
Cho, Wooyong [3 ]
Morillo, Jaime [1 ]
Pitera, Jed [1 ]
Schmidt, Kristin [1 ]
Guillorn, Mike [1 ]
Brink, Markus [1 ]
Sanders, Daniel [1 ]
Felix, Nelson [1 ]
Bailey, Todd [2 ]
Colburn, Matthew [1 ]
机构
[1] IBM Corp, IBM Res Div, Yorktown Hts, NY 10598 USA
[2] GlobalFoundries Inc, Hopewell Jct, NY USA
[3] Samsung Elect Corp, Hopewell Jct, NY USA
来源
关键词
optical lithography; computational lithography; directed self-assembly; optical proximity correction; optical extension; directed self-assembly model; design technology co-optimization; design for manufacturing; design for directed self-assembly; FABRICATION;
D O I
10.1117/1.JMM.16.1.013502
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report a systematic study of the feasibility of using directed self-assembly (DSA) in real product design for 7-nm fin field effect transistor (FinFET) technology. We illustrate a design technology co-optimization (DTCO) methodology and two test cases applying both line/space type and via/cut type DSA processes. We cover the parts of DSA process flow and critical design constructs as well as a full chip capable computational lithography framework for DSA. By co-optimizing all process flow and product design constructs in a holistic way using a computational DTCO flow, we point out the feasibility of manufacturing using DSA in an advanced FinFET technology node and highlight the issues in the whole DSA ecosystem before we insert DSA into manufacturing. (C) 2017 Society of Photo-Optical Instrumentation Engineers (SPIE)
引用
收藏
页数:13
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