Cure mechanism and thermal properties of the phthalide-containing bismaleimide/epoxy system

被引：18
作者：
Xiong, Xuhai [1 ]
Chen, Ping [1 ,2 ]
Ren, Rong [1 ]
Lu, Fang [2 ]
Yu, Qi [1 ]
机构：
[1] Shenyang Aerosp Univ, Liaoning Key Lab Adv Polymer Matrix Composites Mf, Shenyang 110136, Peoples R China
[2] Dalian Univ Technol, State Key Lab Fine Chem, Sch Chem Engn, Dalian 116012, Peoples R China
来源：
THERMOCHIMICA ACTA | 2013年 / 559卷
关键词：
Bismaleimide; Phthalide cardo structure; Epoxy; Cure mechanism; Thermal properties; DIFFERENTIAL SCANNING CALORIMETRY; TETRAFUNCTIONAL EPOXY-RESIN; NEAR-INFRARED SPECTROSCOPY; CURING KINETICS; CARDO STRUCTURE; THERMOSETS; NETWORKS; MATRICES; BLENDS;
D O I：
10.1016/j.tca.2013.02.025
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
A series of novel resin systems were prepared using a novel thermosetting bismaleimide containing phthalide cardo structure (BMIP), diglycidyl ether of bisphenol A epoxy resin (DGEBA) and 4,4'-diamino diphenyl sulfone (DDS). The cure mechanism of the mixture was studied by Fourier transform infrared (FTIR) spectroscopy and differential scanning calorimetry (DSC). The FTIR results demonstrated the cure temperature of BMIP was reduced in the presence of epoxy group. The DSC thermogram of the blends showed three different cure regimes in the temperature range of 150-350 degrees C and the intensity and position of the exothermic peaks were varied with the blend formulation. The cause of their formation was analyzed in detail. Thermal properties of the cured network were characterized by dynamic mechanical analysis (DMA) and thermogravimetric analysis (TGA). Experimental results exhibited that the heat resistance and thermal stability were decreased with the epoxy content and the molar ratio of the BMIP and DDS exhibited little effect on them. (C) 2013 Published by Elsevier B.V.
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页码：52 / 58
页数：7
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