On the Extension of Processing Time with Increase in Temperature during Transient-Liquid Phase Bonding

被引：35

作者：

Abdelfatah, M. M. ^{[1
]}

Ojo, O. A. ^{[1
]}

机构：

[1] Univ Manitoba, Dept Mech & Mfg Engn, Winnipeg, MB R3T 5V6, Canada

来源：

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 2009年 / 40A卷 / 02期

关键词：

INCONEL 738LC SUPERALLOY; ISOTHERMAL SOLIDIFICATION; FILLER METALS;

D O I：

10.1007/s11661-008-9726-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Transient-liquid phase (TLP) bonding of a nickel-based superalloy, IN 738, was performed. Contrary to conventional TLP bonding analytical models, which assume a parabolic relationship between liquid/solid interface migration and holding time, deviation from this law was observed experimentally and by numerical simulation. The deviation, which is caused by reduction in solute concentration gradient below a critical value, is suggested as an alternate phenomenon responsible for anomalous extension of processing time required to produce an eutectic-free joint with increase in bonding temperature. A decrease in the filler gap size and the use of a melting-point depressant (MPD) solute with higher solubility in the base material could reduce the occurrence of the anomalous behavior during a high-temperature TLP joining process.

引用

页码：377 / 385

页数：9

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