共 50 条
- [41] Characteristic Failure Sequence Analysis of IGBT Bonding Wire 2022 4TH INTERNATIONAL CONFERENCE ON SMART POWER & INTERNET ENERGY SYSTEMS, SPIES, 2022, : 1136 - 1139
- [42] Effects of frequency and surface cleanliness of Al-Si electrode on ultrasonic bonding characteristics of thick Al wire bonding MATERIALS TRANSACTIONS JIM, 1996, 37 (09): : 1492 - 1496
- [43] ULTRASONIC ALUMINUM WIRE BONDING TO COPPER CONDUCTORS. Insulation, circuits, 1981, 27 (12): : 51 - 55
- [44] Ultrasonic Features in Wire Bonding and Thermosonic Flip Chip 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 106 - 110
- [46] Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding 2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC, 2022, : 134 - 140
- [47] Piezocomposite transducer for ultrasonic wire bonding in microelectronic packaging 25TH ANNUAL CONFERENCE ON COMPOSITES, ADVANCED CERAMICS, MATERIALS, AND STRUCTURES: B, 2001, 22 (04): : 579 - 584
- [49] MECHANISM AND MODEL OF BOND FORMATION IN ULTRASONIC WIRE BONDING INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2, 2015,
- [50] The design of new ultrasonic transducers for wire bonding devices ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 201 - +