Effects of Bonding Pressure on Nonlinear Dynamic Characteristic of the Ultrasonic Wire Bonding System

Ultrasonic wire bonding is one of the main methods in the package of the chip and substrate of the chip. The vibrations of transducer were tested. Surrogate-data method of phase-randomized based on correlation dimension is proposed to identify the nonlinear chaos of data obtained by ultrasonic wire bonding system. The result indicate there is nonlinear factor in the axial direction of the amplitude transformer terminal when ultrasonic bonding system is loaded different pressure, It is helpful for understanding of transducer and provides the theoretical foundation for further study of the vibration in ultrasonic wire bonding with the nonlinear time series method.