A system-level model for a silicon thermal flow sensor

被引：11
|
作者：
Shen, Guang-Ping [1 ]
Qin, Ming [1 ]
Huang, Qing-An [1 ]
机构：
[1] Southeast Univ, Minist Educ, Key Lab MEMS, Nanjing 210096, Peoples R China
来源：
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2009年 / 15卷 / 02期
基金：
中国国家自然科学基金;
关键词：
Heat Power; Flow Sensor; Convection Coefficient; System Level Model; Circuit Cell;
D O I：
10.1007/s00542-008-0665-5
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A system-level model with lumped parameters for a thermal flow sensor is presented. The model is built with 13 circuit cells consisting of thermal resistors and thermal capacitors in SPICE. The circuit cell originates from the heat conduction equation using the Finite Differential Method, including the 2-D thermal conduction cell, the convection cell, and the thermal capacity in the chip. Based on the thermal model of the flow sensor, the 2-D temperature distribution of the chip can be calculated with SPICE in both the constant power mode (CP) and constant temperature difference mode (CTD). As an example, the system level model of the thermal anemometer in the CTD mode was established in PSPICE. Wind tunnel test was carried out to verify the system model, and show a reasonable agreement with the simulation results, with an error less than 8%.
引用
收藏
页码：279 / 285
页数：7
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