Evaluation of Young's modulus and residual stress of copper films by microbridge testing

被引:16
|
作者
Zhou, ZM [1 ]
Zhou, Y [1 ]
Yang, CS [1 ]
Chen, JA [1 ]
Ding, W [1 ]
Ding, GF [1 ]
机构
[1] Shanghai Jiao Tong Univ, Key Lab Thin Film & Microfabricat Technol Minist, Res Inst Micro Nanometer Sci & Technol, Shanghai 200030, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
mechanical properties; metal thin film; microbridge testing; nanoindentation;
D O I
10.1016/j.sna.2005.12.036
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper investigates the variation of the deflection and maximum stress of copper film microbridge in a wide range of length, thickness, elastic modulus and residual stress by both large and small deflection theories of microbridge testing. The limits of deflection and load for the microbridge samples to be deformed elastically are determined by the assumption that the maximum stress could not be larger than the yield strength. Furthermore, the deflection and load limits of small deflection theory are decided by setting a threshold preset for the normalized deflection and maximum stress difference between large and small deflection theories. Based on the results above, the microbridge dimensions are chosen and the deflection range suitable for the small deflection theory is calculated. The copper film microbridge samples electroplated on silicon substrate are fabricated by MEMS and the microbridge testing is conducted with nanoindenter XP system. From the small deflection theory, the Young's modulus and residual stress for the electroplated copper films is calculated, and it is 115.2 GPa and 19.3 MPa, respectively. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:392 / 397
页数:6
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