Analysis of Crosstalk Delay using Mixed CNT Bundle based Through Silicon Vias

被引：0

作者：

Majumder, Manoj Kumar ^{[1
]}

Kumari, Archana ^{[1
]}

Kaushik, B. K. ^{[1
]}

Manhas, S. K. ^{[1
]}

机构：

[1] Indian Inst Technol Roorkee, Roorkee 247667, Uttarakhand, India

来源：

2014 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM | 2014年

关键词：

Carbon nanotube (CNT); mixed CNT bundle (MCB); through silicon vias (TSVs); crosstalk; delay; nanotechnology; CARBON NANOTUBES; PERFORMANCE ANALYSIS;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This research paper presents a new method to reduce crosstalk of carbon nanotube (CNT) bundle based through silicon vias (TSVs). For this, a unique structure of mixed CNT bundled (MCB) TSV is proposed with specific arrangement of single-(SWCNT) and multi-walled CNTs (MWCNTs). An equivalent electrical model is presented for different MCB configurations wherein MWCNTs are placed at peripheral layers to the centrally located SWCNTs. A significant reduction in crosstalk induced delay is observed for higher number of peripheral layers containing MWCNTs. For different TSV heights, the overall reduction in crosstalk induced delay is 44.03% using novel MCB instead of conventional SWCNT bundle.

引用

页码：441 / 444

页数：4

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