共 50 条
- [1] Silicon Optical Interposer for EPIC 2.5D Integration 2020 ASIA COMMUNICATIONS AND PHOTONICS CONFERENCE (ACP) AND INTERNATIONAL CONFERENCE ON INFORMATION PHOTONICS AND OPTICAL COMMUNICATIONS (IPOC), 2020,
- [2] Heterogeneous 2.5D integration on through silicon interposer APPLIED PHYSICS REVIEWS, 2015, 2 (02):
- [3] Warpage Control of Silicon Interposer for 2.5D Package Application 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 879 - 884
- [4] 2.5D Silicon Photonics Interposer Flip Chip Attach 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 1896 - 1902
- [5] High Bandwidth Application on 2.5D IC Silicon Interposer 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 568 - 572
- [6] Pre-Bond Testing of the Silicon Interposer in 2.5D ICs PROCEEDINGS OF THE 2016 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE), 2016, : 978 - 983
- [7] Comparative Study of Transmission Lines Design for 2.5D Silicon Interposer 2013 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2013, : 312 - 316
- [8] A Scalable and Reconfigurable 2.5D Integrated Multicore Processor on Silicon Interposer 2015 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2015,
- [9] Researchon Mechanical Behavior of Through silicon via of 2.5D Interposer 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 913 - 918
- [10] Thermal-Mechanical Analysis of TSV Array in 2.5D Silicon Interposer 2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,