Enhanced fracture toughness of bulk nanocrystalline Cu with embedded nanoscale twins

被引：77
作者：
Qin, E. W. [1 ]
Lu, L. [1 ]
Tao, N. R. [1 ]
Lu, K. [1 ]
机构：
[1] Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
来源：
SCRIPTA MATERIALIA | 2009年 / 60卷 / 07期
关键词：
Fracture toughness; Twin boundary; Copper; Dynamic plastic deformation; Nanocrystalline; DYNAMIC PLASTIC-DEFORMATION; MECHANICAL-PROPERTIES; COPPER; FATIGUE; METALS; DUCTILITY; STRENGTH; BEHAVIOR;
D O I：
10.1016/j.scriptamat.2008.12.012
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
We report an enhanced fracture toughness of bulk Cu sample processed by dynamic plastic deformation with a composite microstructure of nanoscale grains and embedded nanoscale twin bundles. The improvement in fracture toughness is mainly due to the embedded twin bundles which generate elongated deep fracture dimples that consume much higher fracture energy. (C) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：539 / 542
页数：4
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