Effect of Ag Addition on the Intermetallic Compound and Joint Strength between Sn-Zn-Bi Lead Free Solder and Copper Substrate

被引：0
作者：
Jasli, Nor Aishah [1 ]
Abd Hamid, Hamidi [1 ]
Mayappan, Ramani [1 ]
机构：
[1] Univ Teknol MARA, Fac Sci Appl, Arau 02600, Perlis, Malaysia
来源：
2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT) | 2012年
关键词：
INTERFACIAL REACTIONS; GROWTH; MICROSTRUCTURE; ALLOYS; CU;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This study investigated the effect of Ag addition on the formation of intermetallic compounds and joint strength of the Sn-Zn-Bi based alloys under liquid state aging. The intermetallic compounds were formed by reacting Sn-8Zn-3Bi and (Sn-8Zn-3Bi)-IAg lead free solders on copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. It was found that for Sn-8Zn-3Bi solder reacting with Cu substrate, the Cu5Zn8 intermetallic was formed. On the other hand, when 1% Ag was added into the solder, the Cu3Sn and Cu6Sn5 IMC were formed. The morphology of the CusZng intermetallic was flat whereas for Cu3Sn and Cu6Sn5 were rather scallop. The addition of Ag into the Sn-Zn-Bi solder increases the shear strength of the solder joint. It is believed the scallop morphology of Cu-Sn contribute to strengthening the (Sn-8Zn-3Bi)-1Ag/Cu joints.
引用
收藏
页数：4
相关论文
共 16 条
  • [1] Lead-free solders in microelectronics
    Abtew, M
    Selvaduray, G
    [J]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2000, 27 (5-6) : 95 - 141
  • [2] Ahmad Mansur, 2010, J MICROELECTRONICS R, V50, P1134
  • [3] Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles
    Guo, F
    Lee, J
    Choi, S
    Lucas, JP
    Bieler, TR
    Subramanian, KN
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1073 - 1082
  • [4] Kinetics of intermetallic compound layer growth and interfacial reactions between Sn-8Zn-5In solder and bare copper substrate
    Kim, DG
    Jang, HS
    Jung, SB
    [J]. MATERIALS SCIENCE AND TECHNOLOGY, 2005, 21 (03) : 381 - 385
  • [5] Interfacial reactions between lead-free solders and common base materials
    Laurila, T
    Vuorinen, V
    Kivilahti, JK
    [J]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2005, 49 (1-2) : 1 - 60
  • [6] Growth of intermetallic compounds in the Sn-9Zn/Cu joint
    Lee, C. S.
    Shieu, F. S.
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (08) : 1660 - 1664
  • [7] Interfacial reactions between Sn-8Zn-3Bi-xNi lead-free solders and Cu substrate during isothermal aging
    Liu, Lijuan
    Zhou, Wei
    Li, Baoling
    Wu, Ping
    [J]. MATERIALS CHEMISTRY AND PHYSICS, 2010, 123 (2-3) : 629 - 633
  • [8] Interfacial reactions between Sn-8Zn-3Bi-xAg lead-free solders and Cu substrate
    Liu, Lijuan
    Zhou, Wei
    Li, Baoling
    Wu, Ping
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 482 (1-2) : 90 - 98
  • [9] Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder
    Mayappan, Ramani
    Ahmad, Zainal Arifin
    [J]. INTERMETALLICS, 2010, 18 (04) : 730 - 735
  • [10] Retardation of spalling by the addition of Ag in Sn-Zn-Bi solder with the Au/Ni metallization
    Sharif, A.
    Chan, Y. C.
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 445 : 686 - 690
12