Natural Convection Cooling of an Array of Flush Mounted Discrete Heaters Inside a 3D Cavity

被引:5
作者
Nayaki, V. P. M. Senthil [1 ,2 ]
Saravanan, S. [1 ]
Niu, X. D. [3 ]
Kandaswamy, P. [4 ]
机构
[1] Bharathiar Univ, Dept Math, Coimbatore 641046, Tamil Nadu, India
[2] KPR Inst Engn & Technol, Dept Math, Coimbatore 641407, Tamil Nadu, India
[3] Shantou Univ, Coll Engn, Shantou 515063, Guangdong, Peoples R China
[4] Doshisha Univ, Res Ctr Energy Convers Syst, Kyoto 6100394, Japan
关键词
Natural convection; rectangular cavity; array heaters; heat removal; electronic equipment cooling; 3-DIMENSIONAL ENCLOSURE; ASPECT RATIO; SUBSTRATE; LAMINAR; CHIPS;
D O I
10.4208/aamm.2015.m1245
中图分类号
O29 [应用数学];
学科分类号
070104 ;
摘要
An investigation of natural convective flow and heat transfer inside a three dimensional rectangular cavity containing an array of discrete heat sources is carried out. The array consists of a row and columnwise regular arrangement of identical square shaped isoflux discrete heaters and is flush mounted on a vertical wall of the cavity. A symmetrical isothermal sink condition is maintained by cooling the cavity uniformly from either the opposite wall or the side walls or the top and bottom walls. The other walls of the cavity are maintained adiabatic. A finite volume method based on the SIMPLE algorithm and the power law scheme is used to solve the conservation equations. The parametric study covers the influence of pertinent parameters such as the Rayleigh number, the Prandtl number, side aspect ratio of the cavity and cavity heater ratio. A detailed fluid flow and heat transfer characteristics for the three cases are reported in terms of isothermal and velocity vector plots and Nusselt numbers. In general it is found that the overall heat transfer rate within the cavity for Ra = 10(7) is maximum when the side aspect ratio of the cavity lies between 1.5 and 2. A more complex and peculiar flow pattern is observed in the presence of top and bottom cold walls which in turn introduces hot spots on the adiabatic walls. Their location and size are highly sensitive to the side aspect ratio of the cavity and hence offers more effective ways for passive heat removal.
引用
收藏
页码:698 / 721
页数:24
相关论文
共 46 条
[1]  
[Anonymous], 1980, Numerical heat transfer and fluid flow
[2]   Time-dependent buoyant convection in an enclosure with discrete heat sources [J].
Bae, JH ;
Hyun, JM .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2004, 43 (01) :3-11
[3]  
Bar-Cohen A, 1991, ASME JSME THERM ENG, V2, pxv
[4]   Direct liquid cooling of high flux micro and nano electronic components [J].
Bar-Cohen, Avram ;
Arik, Mehmet ;
Ohadi, Michael .
PROCEEDINGS OF THE IEEE, 2006, 94 (08) :1549-1570
[5]   Numerical study of the natural convection in cavity heated from the lower corner and cooled from the ceiling [J].
Ben Nasr, K ;
Chouikh, R ;
Kerkeni, C ;
Guizani, A .
APPLIED THERMAL ENGINEERING, 2006, 26 (07) :772-775
[6]   Experimental study of transient natural convection heat transfer from simulated electronic chips [J].
Bhowmik, H ;
Tou, KW .
EXPERIMENTAL THERMAL AND FLUID SCIENCE, 2005, 29 (04) :485-492
[7]   High power electronic component: Review [J].
Chen, Ping H. ;
Chang, Shyy W. ;
Chiang, Kuei F. ;
Li, Ji .
Recent Patents on Engineering, 2008, 2 (03) :174-188
[8]   Study of buoyancy-induced flows subjected to partially heated sources on the left and bottom walls in a square enclosure [J].
Chen, Tzong-Huei ;
Chen, Li-Yueh .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2007, 46 (12) :1219-1231
[9]   EFFECT OF HEATER SIZE, LOCATION, ASPECT RATIO, AND BOUNDARY-CONDITIONS ON 2-DIMENSIONAL, LAMINAR, NATURAL-CONVECTION IN RECTANGULAR CHANNELS [J].
CHU, HHS ;
CHURCHILL, SW ;
PATTERSON, CVS .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1976, 98 (02) :194-201
[10]   The challenges of electronic cooling: Past, current and future [J].
Chu, RC .
JOURNAL OF ELECTRONIC PACKAGING, 2004, 126 (04) :491-500