Electromagnetic Radiation Resulting From PCB/High-Density Connector Interfaces

被引：22

作者：

Archambeault, Bruce ^{[1
]}

Connor, Sam ^{[1
]}

Halligan, Matthew S. ^{[2
]}

Drewniak, James L. ^{[2
]}

Ruehli, Albert E. ^{[2
]}

机构：

[1] IBM Corp, Res Triangle Pk, NC 27709 USA

[2] Missouri Univ Sci & Technol, Electromagnet Compatibil EMC Lab, Rolla, MO 65401 USA

来源：

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | 2013年 / 55卷 / 04期

基金：

美国国家科学基金会;

关键词：

Antenna mode; common mode; electromagnetic radiation; printed circuit board (PCB) connectors; MODE CURRENTS; COMMON-MODE;

D O I：

10.1109/TEMC.2013.2261736

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Professor Clayton Paul made many contributions to the field of electromagnetic compatibility as a researcher, teacher, and mentor. Among these contributions, he provided a seminal push in characterizing, understanding, and quantifying the coupling and radiation physics of electromagnetic interference (EMI). An overview of these original contributions that were driven by industry problems and needs is given here. His work emphasized physics and formulation in order to provide quantitative solutions and design directions. These ideas are applied to a current industry challenge in understanding and quantifying EMI that results at the interface between high-speed, high-density connectors and printed circuit boards.

引用

页码：614 / 623

页数：10

共 19 条

[1]

[Anonymous], P IEEE INT S EL COMP

[2]

[Anonymous], P IEEE INT S EL COMP

[3] COMBINED DIFFERENTIAL AND COMMON-MODE SCATTERING PARAMETERS - THEORY AND SIMULATION [J].