SUBSTRATE EFFECT IN SQUEEZE FILM DAMPING OF LATERAL OSCILLATING MICROSTRUCTURES

被引:0
|
作者
Li, Mo [1 ]
Rouf, Vashwar T. [1 ]
Horsley, David A. [1 ]
机构
[1] Univ Calif Davis, Davis, CA 95616 USA
来源
26TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2013) | 2013年
关键词
MODEL;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present a new squeeze film damping model for lateral oscillating microstructures which for the first time accounts for the increased damping created by proximity to the substrate. The proposed model improves the estimation of damping by a factor of 2 to 4 when the distance to the substrate is less than or equal to the gap between oscillating plates. The closed-form solution of this model agrees with the predictions of a FEM model within 12%. Experimental results show that the new model improves the accuracy of the estimated damping by approximately a factor of 2.
引用
收藏
页码:393 / 396
页数:4
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