Interface kinetics of combustion-diffusion bonding of Ni3Al/Ni and TiAl/Ti under direct current field

被引：11

作者：

Chen, S. P. ^{[1
,2
]}

Dong, F. ^{[1
]}

Fan, W. H. ^{[1
]}

Meng, Q. S. ^{[1
]}

Munir, Zuhair A. ^{[2
]}

机构：

[1] Taiyuan Univ Technol, Coll Mat Sci & Engn, Taiyuan 030024, Peoples R China

[2] Univ Calif Davis, Dept Chem Engn & Mat Sci, Davis, CA 95616 USA

来源：

JOURNAL OF MATERIALS SCIENCE | 2013年 / 48卷 / 03期

基金：

山西省青年科学基金; 美国国家科学基金会;

关键词：

ASSISTED SYNTHESIS PROCESS; GRADED MATERIALS; MULTILAYERS; ALLOYS;

D O I：

10.1007/s10853-012-6869-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The bonding of TiB2-Ni and TiC-Ni composites to, respectively, Ni and Ti substrates was investigated by field-activated and pressure-assisted synthesis. Bonding and in situ synthesis was utilized to prepare (TiB2)(p)Ni/Ni3Al/Ni (Composition 1) and (TiC)(p)Ni/TiAl/Ti (Composition 2) joining structures. The effect of applied current on the kinetics of formation of the diffusion layer between the substrate (Ni or Ti) and the respective intermetallic layer (Ni3Al or TiAl) was investigated. For both compositions, the current was shown to have a marked influence of the activation energy of formation of the layer, decreasing it by as much as 31 %. Calculations of adiabatic temperatures suggest a possible current contribution to interdiffusion, as has been reported previously.

引用

页码：1268 / 1274

页数：7

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