Electroless Deposition of Copper on Organic and Inorganic Substrates Using a Sn/Ag Catalyst

被引：32

作者：

Fritz, Nathan ^{[1
]}

Koo, Hyo-Chol ^{[1
]}

Wilson, Zachary ^{[1
]}

Uzunlar, Erdal ^{[1
]}

Wen, Zhongsheng ^{[1
]}

Yeow, Xinyi ^{[1
]}

Allen, Sue Ann Bidstrup ^{[1
]}

Kohl, Paul A. ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Chem & Biomol Engn, Atlanta, GA 30332 USA

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2012年 / 159卷 / 06期

关键词：

WET CHEMICAL TREATMENTS; EPOXY POLYMER LAYERS; SURFACE-ROUGHNESS; BUILDUP LAYERS; NANOPARTICLES; PRETREATMENT; ACTIVATION; POLYIMIDE; CU;

D O I：

10.1149/2.099206jes

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

In this study, the electroless deposition of copper and silver was investigated on epoxy and silicon dioxide-based substrates. A cost-efficient, Sn/Ag catalyst was investigated as a replacement for the Sn/Pd catalyst currently used in board technology. The surface of the epoxy based polyhedral oligomeric silsesquioxane (POSS) films was modified by plasma and chemical etching for electroless activation without the creation of a roughened surface. The electroless copper deposited on the modified POSS surface exhibited excellent adhesion when annealed at 180 degrees C in nitrogen for 90 min or at room temperature for 24 hr. Electroless copper deposition was also demonstrated on oxidized silicon wafers for through silicon via sidewall deposition.

引用

页码：D386 / D392

页数：7

共 24 条

[1]

[Anonymous], 2009, INT TECHNOLOGY ROADM

[2]

Bari G.A., 2010, Modern electroplating, V5th

[3] The inhibition of silver agglomeration by gold activation in silver electroless plating [J].

Cha, SH ;

Koo, HC ;

Kim, JJ .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (06) :C388-C391

[4] Laser-induced site-selective silver seeding on polyimide for electroless copper plating [J].

Chen, Dongsheng ;

Lu, Qinghua ;

Zhao, Yan .

APPLIED SURFACE SCIENCE, 2006, 253 (03) :1573-1580

[5] MOSSBAUER STUDY OF TIN(II) SENSITIZER DEPOSITS ON KAPTON [J].

COHEN, RL ;

DAMICO, JF ;

WEST, KW .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (12) :2042-&

[6] Wideband frequency-domain characterization of FR-4 and time-domain causality [J].

Djordjevic, AR ;

Biljic, RM ;

Sarkar, TK .

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2001, 43 (04) :662-667

[7] Surface activation of polyimide with dielectric barrier discharge for electroless metal deposition [J].

Esrom, H ;

Seeböck, R ;

Charbonnier, M ;

Romand, M .

SURFACE & COATINGS TECHNOLOGY, 2000, 125 (1-3) :19-24

[8] SOME ASPECTS OF CHEMISTRY OF TIN SENSITIZING SOLUTIONS [J].

FELDSTEIN, N ;

SCHNABLE, GL ;

WEINER, JA .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (11) :1486-+

[9] CONTACT ANGLE MEASUREMENTS OF TIN SENSITIZING SOLUTIONS [J].

FELDSTEIN, N ;

WEINER, JA .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (06) :668-+

[10] Photodefinable Epoxycyclohexyl Polyhedral Oligomeric Silsesquioxane [J].

Fritz, Nathan ;

Saha, Rajarshi ;

Allen, Sue Ann Bidstrup ;

Kohl, Paul A. .

JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (02) :149-156

← 1 2 3 →