Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder

被引：104

作者：

Tsao, L. C. ^{[1
]}

Huang, C. H. ^{[2
]}

Chung, C. H. ^{[1
]}

Chen, R. S. ^{[2
]}

机构：

[1] Natl Pingtung Univ Sci & Technol, Grad Inst Mat Engn, Neipu 91201, Pingtung, Taiwan

[2] Natl Cheng Kung Univ, Dept Engn Sci, Tainan 701, Taiwan

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2012年 / 545卷

关键词：

Sn0.7 Cu nano-composite solder; TiO2; nanoparticles; Mechanical property; Strengthening mechanisms; BGA PACKAGES; BONDING STRENGTHS; MICROHARDNESS;

D O I：

10.1016/j.msea.2012.03.025

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Composites of SC solder reinforced with 0,0.25,0.5 and 1 wt.% of TiO2 nanoparticles were fabricated using a mechanical technique. With increased addition of TiO2 nanoparticles, the SC nano-composite solder was found to have a slightly lower melting temperature. The addition of TiO2 nanoparticles can also effectively refine the microstructure as so beta-Sn and Cu6Sn5, and increase the percentage of eutectic area. The mechanical properties (microhardness, 0.2% YS and UTS) increase with the increasing presence of reinforcement, far exceeding the strength of the eutectic SC solder. The yield strength improvement was attributed to (i) the Hall-Petch effect due to beta-Sn grain size refinement. (ii) Orowan strengthening, (iii) generation of geometrically necessary dislocations to accommodate CTE mismatch between the matrix and the second phase (Cu6Sn5 and TiO2), and (iv) the load-bearing effects due to the presence of nano-sized reinforcements. (c) 2012 Elsevier B.V. All rights reserved.

引用

页码：194 / 200

页数：7

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