Impact of Geometry of Electronic Components on Cooling Improvement

被引:11
|
作者
Meghdir, Abed [1 ]
Benabdallah, Tawfik [2 ]
Dellil, Ahmed Z. E. [1 ]
机构
[1] Univ Oran2 Mohame Ben Ahmed, Inst Maintenance & Ind Secur, Dept Electro Mecan, Oran, Algeria
[2] Natl Polytech Sch Oran ENPO Maurice Audin, Dept Mechan, Oran, Algeria
关键词
cooling of electronic components; SST turbulence Model; heat transfer; forced convection; HEAT-TRANSFER; TURBULENCE MODELS; MOUNTED CUBE; FLOW; JET; SIMULATIONS; CONVECTION; ENCLOSURE;
D O I
10.18280/ijht.370121
中图分类号
O414.1 [热力学];
学科分类号
摘要
In this paper we have numerically treated the thermal and dynamic aspect of different prismatic bodies simulating electronic components, heated and mounted on the lower wall of a channel. These components are cooled by forced convection using a turbulent flow flowing along the channel and an impinging jet flowing from the upper wall perpendicularly to them. The fluid used is air of which we vary the Reynolds number in order to see its impact on the component cooling. We opted for four different geometries of the prismatic body taken in the same working conditions. We compared the results obtained to propose one of the geometries which will permit a better evacuation of the heat, thus a good cooling of the component. By combining an unstructured mesh with the finite volume method, the solution is obtained by using the SIMPLE algorithm (pressure-velocity coupling). Turbulence is modeled using the so-called Shear Stress Transport (SST) model to evaluate the heat exchange in these configurations. This numerical study is carried out with the code ANSYS. CFX 14 to evaluate the thermal exchanges.
引用
收藏
页码:167 / 178
页数:12
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