共 50 条
- [31] Designing a fluid pump for microfluidic cooling systems in electronic components PROCEEDINGS OF THE 1997 1ST ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, 1997, : 115 - 118
- [33] COOLING OF POWER ELECTRONIC COMPONENTS BY 2-PHASE THERMOSIPHON REVUE GENERALE DE THERMIQUE, 1993, 32 (373): : 17 - 24
- [36] COOLING ELECTRONIC COMPONENTS MOUNTED ON A VERTICAL WALL BY NATURAL CONVECTION PROCEEDINGS OF CHT-12 - ICHMT INTERNATIONAL SYMPOSIUM ON ADVANCES IN COMPUTATIONAL HEAT TRANSFER, 2012, : 1293 - 1310
- [38] Impact of nanoparticle shape on thermohydraulic performance of a nanofluid in an enhanced microchannel heat sink for utilization in cooling of electronic components CHINESE JOURNAL OF CHEMICAL ENGINEERING, 2021, 40 : 36 - 47
- [40] Improvement of Effectiveness of Cooling of Electronic Heat-Loaded Modules VISNYK NTUU KPI SERIIA-RADIOTEKHNIKA RADIOAPARATOBUDUVANNIA, 2020, (81): : 47 - 55