Effects of Sulfur on the Properties of Sn-9Zn as Lead-Free Solder

被引：8

作者：

Wei, Xiuqin ^{[1
]}

Li, Yinghui ^{[1
]}

Huang, Huizhen ^{[1
]}

机构：

[1] Nanchang Univ, Sch Mat Sci & Engn, 999 Xuefu Rd, Nanchang 330031, Jiangxi, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2017年 / 46卷 / 02期

基金：

中国国家自然科学基金;

关键词：

Sn-9Zn; lead-free solder; sulfur; wettability; corrosion; SN-ZN; CORROSION-RESISTANCE; SURFACE SEGREGATION; NACL SOLUTION; ALLOYS; CU; MICROSTRUCTURE; AG; AL; SUBSTRATE;

D O I：

10.1007/s11664-016-4994-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effects of sulfur on the wettability of Sn-9Zn on Cu, and on the corrosion of the alloy were examined by means of spreading tests and potentiodynamic polarization tests, respectively. Sulfur improves the wettability of Sn-9Zn when its content in the alloy is in the range 0.015-0.1 wt.% and the optimal S content is 0.02 wt.%. In potentiodynamic polarization tests, sulfur did not significantly affect the corrosion potential or corrosion current, but increasing the sulfur increased the passivation current density. The mechanisms underlying these effects of sulfur on the properties of Sn-9Zn are discussed.

引用

页码：1067 / 1071

页数：5

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