Characterization of p-type buffer layers for SiC microwave device applications

被引:0
作者
Konstantinov, AO [1 ]
Karlsson, S [1 ]
Nilsson, PÅ [1 ]
Saroukhan, AM [1 ]
Svedberg, JO [1 ]
Nordell, N [1 ]
Harris, CI [1 ]
Eriksson, J [1 ]
Rorsman, N [1 ]
机构
[1] Ind Microelect Ctr, S-16440 Kista, Sweden
来源
WIDE-BANDGAP SEMICONDUCTORS FOR HIGH-POWER, HIGH-FREQUENCY AND HIGH-TEMPERATURE APPLICATIONS-1999 | 1999年 / 572卷
关键词
D O I
10.1557/PROC-572-197
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Low-loped p-type silicon carbide buffer layers are grown by chemical vapor deposition on conducting and semi-insulating substrates. Capacitance-voltage and electrical admittance techniques are developed for accurate non-destructive characterization. The electrical admittance techniques suggested are capable of measuring the resistivity in a very wide range, up to 7 orders of magnitude. MESFET devices using thick buffer layers on conducting substrates are reported with F-t = 8.4 GHz and F-max = 32 GHz.
引用
收藏
页码:197 / 200
页数:4
相关论文
共 4 条
[1]   Silicon carbide MESFET's for high-power S-band applications [J].
Allen, ST ;
Sadler, RA ;
Alcorn, TS ;
Sumakeris, J ;
Glass, RC ;
Carter, CH ;
Palmour, JW .
SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2, 1998, 264-2 :953-956
[2]   Characterization of power MESFETs on 4H-SiC conductive and semi-insulating wafers [J].
Noblanc, O ;
Arnodo, C ;
Chartier, E ;
Brylinski, C .
SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2, 1998, 264-2 :949-952
[3]  
PALMOUR JW, 1994, I PHYS PUB, V137, P495
[4]   Silicon carbide high frequency devices [J].
Weitzel, CE .
SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2, 1998, 264-2 :907-912